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| 6 A UL RECOGNITION A 11.15 0.15 (0.442 0.006) 8 7 6 5 11.00 MAX. (0.433) 9.00 0.15 (0.354 0.006) TYPE NUMBER A HP HCNWXXXX YYWW DATE CODE 1 2 3 4 1.55 (0.061) MAX. 10.16 (0.400) TYP. 7 TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 2.54 (0.100) TYP. 1.78 0.15 (0.070 0.006) 0.40 (0.016) 0.56 (0.022) 0.51 (0.021) MIN. DIMENSIONS IN MILLIMETERS (INCHES). 11.15 0.15 (0.442 0.006) 8 7 6 5 PAD LOCATION (FOR REFERENCE ONLY) 6 6.15 (0.242)TYP. 9.00 0.15 (0.354 0.006) 12.30 0.30 (0.484 0.012) 1 2 3 4 1.3 (0.051) 1.55 (0.061) MAX. 12.30 0.30 (0.484 0.012) 11.00 MAX. (0.433) 0.9 (0.035) 4.00 MAX. (0.158) 1.78 0.15 (0.070 0.006) 2.54 (0.100) BSC 0.75 0.25 (0.030 0.010) 1.00 0.15 (0.039 0.006) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 7 NOM. DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 T = 145C, 1C/SEC T = 115C, 0.3C/SEC TEMPERATURE - C T = 100C, 1.5C/SEC 1 2 3 4 5 6 7 8 9 10 11 12 TIME - MINUTES MAXIMUM SOLDER REFLOW THERMAL PROFILE (NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.) 6 6 6 6 (VCC - VEE - VOL) Rg --------------- IOLPEAK (VCC - VEE - 2 V) = ---------------- IOLPEAK (15 V + 5 V - 2 V) = ------------------ 2.5 A = 7.2 8 f 6 || || 6 6 |
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